Products
Ceramic Lid for Resin Sealing
Overview
Ceramic lid with epoxy glue precoat is suitable for heat-sensitive devices.
Features
Function
- Ceramic Lid with epoxy glue precoat achieves hermetic seal against gross leak.
Highlights
- Ceramic Lid with epoxy glue precoat is formulated for sealing as low as 170 degree C.
- Glue volume is adjustable and can be optimaized.
- We can optimize gel time to suit customer's sealing conditions.
- Lead-free materials help reduce environmental impact.
Product usage
LDMOS and GaN RF power devices
Product Lineup
For the information on the products,
contact us via the following.
- Tokyo Sales Division 03-6779-5050 FAX:03-6779-5030