Products
Ceramic Packages for Millimeter Wave Devices
Overview
These packages are for RF millimeter bandwidth in mobile phone micro base station and others. With a RF wave design and high thermal dissipation design that use simulation technologies, we offer customized design in accordance with customers’ needs.
Features
High thermal dissipation
By brazing together high thermal dissipation materials, the product achieves high thermal dissipation.
High reliability
We offer high-reliability designs with chip thermal expansion taken into consideration.
High flatness
By matching thermal expansion between ceramics and heat sinks and by backside surface processing, we achieve high flatness.
Heat resistance
We provide various plating options to meet customers’ needs.
Product usage
Commercial use
- Macro/micro base station PA
Industrial use
- Aviation, space, and satellite communications
- Radar
- Energy
Product specifications
| Flange | CuMo, CPC®*1, and others |
|---|---|
| Ceramics | High-strength HTCC*2 |
| Electrode | Tungsten |
| External dimension | ~50mm |
| Plating | Electrolytic Ni/Au, electrolytic Ni/Pd/Au |
*1 CPC®: radiator plate in which Cu-Mo composite is laminated with Cu layers at top and bottom
(CPC® is a registered trademark of A.L.M.T. Corp.)
*2 HTCC：High Temperature Co-fired Ceramic
For the information on the products,
contact us via the following.
- Tokyo Sales Division 03-6779-5050 FAX:03-6779-5030